Conductive PE Foam for Electronic Packaging is a lightweight, flexible material engineered to provide ESD protection and mechanical cushioning for sensitive electronic components. Made from crosslinked polyethylene (PE) (density: 0.03–0.08 g/cm³) infused with conductive carbon particles (10–15% by weight), it offers permanent static dissipation without relying on environmental humidity. This foam is widely used in electronics manufacturing, transportation, and storage, with a 40% market share in ESD cushioning materials for delicate components.
Surface resistivity of 10⁶–10⁹ ohms/sq (per STM11.11) ensures rapid charge neutralization, with volume resistivity <10⁸ ohms-cm for 3D electrostatic control.
Conductive lattice structure allows efficient grounding via copper tabs or adhesive tapes, preventing electrostatic buildup even in low-humidity environments (<30% RH).
Closed-cell design provides excellent impact absorption (energy absorption: 2.5–5 J/cm³ at 10 m/s impact) and vibration damping (natural frequency: 10–30 Hz).
Compression set resistance <10% (after 22 hours at 70°C) maintains shape after repeated use, suitable for reusable packaging systems.
Withstands temperatures up to 120°C (short-term) and -40°C (long-term), maintaining conductivity across -50°C to 80°C operating range.
Resists oils, solvents (isopropyl alcohol, acetone), and weak acids, with no measurable degradation after 1000 hours of exposure.
Layer | Material | Function |
outer coating | Antistatic polymer materials | Dissipate static electricity |
Outer Layer | PET | Patterns or instructions can be printed on the surface to enhance physical strength and effectively isolate air |
Middle Layer | AL | Effective electromagnetic shielding, and can block the penetration of light, gas, and moisture |
Barrier layer | NY (optional) | Improve puncture resistance, suitable for products to prevent oxidation and vacuum packaging |
Inner Layer | CPE | Can be used for heat sealing bag making, with good tensile strength |
inner coating | Antistatic polymer materials | Dissipate static electricity |
Available in 0.5–100 mm thicknesses and densities (30–80 kg/m³), with die-cutting capabilities for complex shapes (tolerances: ±0.1 mm) using CNC routers.
Optional pressure-sensitive adhesives (PSAs) on one or both sides for easy installation in trays and containers.
Electronics Assembly: Protecting PCBs, LCD panels (2–75 inch), and connectors during pick-and-place operations and manual handling.
Transportation: Lining shipping containers (cartons) to prevent component damage from shocks (ISTA 3A compliant) and vibrations during transit.
Military and Aerospace: Providing ESD-safe padding for avionics (flight control modules) and defense equipment (radar components) in MIL-STD-883H environments.
Medical Equipment: Cushioning delicate sensors (EEG, ECG probes) and diagnostic tools (ultrasound transducers) in sterile packaging.
Q: Does the foam lose its conductivity over time?
A: No, the conductive properties are permanent due to homogeneous carbon particle distribution, with resistivity changes <10% after 5 years of indoor storage.
Q: Can it be used in cleanroom environments?
A: Yes, low particle generation (<10 particles/ft³ ≥0.5μm) makes it suitable for Class 100 cleanrooms, with options for laser-cut edges to minimize debris.
Q: How do I attach the foam to surfaces?
A: It can be bonded using ESD-safe adhesives (acrylic-based, surface resistivity 10⁶–10⁹ ohms) or double-sided tapes, with peel strength ≥0.5 N/cm for secure attachment.
Q: Is it flame retardant?
A: Some grades meet UL94 V-0 standards for flame resistance (self-extinguishing within 10 seconds), suitable for aerospace and automotive applications with fire safety requirements.
Conductive PE Foam for Electronic Packaging is a lightweight, flexible material engineered to provide ESD protection and mechanical cushioning for sensitive electronic components. Made from crosslinked polyethylene (PE) (density: 0.03–0.08 g/cm³) infused with conductive carbon particles (10–15% by weight), it offers permanent static dissipation without relying on environmental humidity. This foam is widely used in electronics manufacturing, transportation, and storage, with a 40% market share in ESD cushioning materials for delicate components.
Surface resistivity of 10⁶–10⁹ ohms/sq (per STM11.11) ensures rapid charge neutralization, with volume resistivity <10⁸ ohms-cm for 3D electrostatic control.
Conductive lattice structure allows efficient grounding via copper tabs or adhesive tapes, preventing electrostatic buildup even in low-humidity environments (<30% RH).
Closed-cell design provides excellent impact absorption (energy absorption: 2.5–5 J/cm³ at 10 m/s impact) and vibration damping (natural frequency: 10–30 Hz).
Compression set resistance <10% (after 22 hours at 70°C) maintains shape after repeated use, suitable for reusable packaging systems.
Withstands temperatures up to 120°C (short-term) and -40°C (long-term), maintaining conductivity across -50°C to 80°C operating range.
Resists oils, solvents (isopropyl alcohol, acetone), and weak acids, with no measurable degradation after 1000 hours of exposure.
Layer | Material | Function |
outer coating | Antistatic polymer materials | Dissipate static electricity |
Outer Layer | PET | Patterns or instructions can be printed on the surface to enhance physical strength and effectively isolate air |
Middle Layer | AL | Effective electromagnetic shielding, and can block the penetration of light, gas, and moisture |
Barrier layer | NY (optional) | Improve puncture resistance, suitable for products to prevent oxidation and vacuum packaging |
Inner Layer | CPE | Can be used for heat sealing bag making, with good tensile strength |
inner coating | Antistatic polymer materials | Dissipate static electricity |
Available in 0.5–100 mm thicknesses and densities (30–80 kg/m³), with die-cutting capabilities for complex shapes (tolerances: ±0.1 mm) using CNC routers.
Optional pressure-sensitive adhesives (PSAs) on one or both sides for easy installation in trays and containers.
Electronics Assembly: Protecting PCBs, LCD panels (2–75 inch), and connectors during pick-and-place operations and manual handling.
Transportation: Lining shipping containers (cartons) to prevent component damage from shocks (ISTA 3A compliant) and vibrations during transit.
Military and Aerospace: Providing ESD-safe padding for avionics (flight control modules) and defense equipment (radar components) in MIL-STD-883H environments.
Medical Equipment: Cushioning delicate sensors (EEG, ECG probes) and diagnostic tools (ultrasound transducers) in sterile packaging.
Q: Does the foam lose its conductivity over time?
A: No, the conductive properties are permanent due to homogeneous carbon particle distribution, with resistivity changes <10% after 5 years of indoor storage.
Q: Can it be used in cleanroom environments?
A: Yes, low particle generation (<10 particles/ft³ ≥0.5μm) makes it suitable for Class 100 cleanrooms, with options for laser-cut edges to minimize debris.
Q: How do I attach the foam to surfaces?
A: It can be bonded using ESD-safe adhesives (acrylic-based, surface resistivity 10⁶–10⁹ ohms) or double-sided tapes, with peel strength ≥0.5 N/cm for secure attachment.
Q: Is it flame retardant?
A: Some grades meet UL94 V-0 standards for flame resistance (self-extinguishing within 10 seconds), suitable for aerospace and automotive applications with fire safety requirements.
